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Literature Review and Meta-Analysis of Transcutaneous Electrical Nerve Stimulation in Treating Chronic Back Pain

Authors

  • Lien-Chen Wu Institute of Biomedical Engineering, College of Engineering, College of Medicine, National Taiwan University, Taipei, TaiwanDepartment of Orthopaedics, Shuang Ho Hospital, Taipei, TaiwanDepartment of Orthopaedics, School of Medicine, College of Medicine, Taipei Medical University, Taipei, Taiwan PubMed articlesGoogle scholar articles
  • Pei-Wei Weng Department of Orthopaedics, Shuang Ho Hospital, Taipei, TaiwanDepartment of Orthopaedics, School of Medicine, College of Medicine, Taipei Medical University, Taipei, Taiwan PubMed articlesGoogle scholar articles
  • Chia-Hsien Chen Department of Orthopaedics, Shuang Ho Hospital, Taipei, TaiwanDepartment of Orthopaedics, School of Medicine, College of Medicine, Taipei Medical University, Taipei, Taiwan PubMed articlesGoogle scholar articles
  • Yi-You Huang Institute of Biomedical Engineering, College of Engineering, College of Medicine, National Taiwan University, Taipei, Taiwan PubMed articlesGoogle scholar articles
  • Yang-Hwei Tsuang Department of Orthopaedics, Shuang Ho Hospital, Taipei, TaiwanDepartment of Orthopaedics, School of Medicine, College of Medicine, Taipei Medical University, Taipei, Taiwan PubMed articlesGoogle scholar articles
  • Chang-Jung Chiang Department of Orthopaedics, Shuang Ho Hospital, Taipei, TaiwanDepartment of Orthopaedics, School of Medicine, College of Medicine, Taipei Medical University, Taipei, Taiwan PubMed articlesGoogle scholar articles
  1. Address correspondence to: Chang-Jung Chiang, MD, PhD, Department of Orthopaedics, Shuang Ho Hospital, Taipei Medical University, Taiwan No. 291, Zhongzheng Rd, Zhonghe District, New Taipei City 23561, Taiwan (e-mail: cjchiang{at}s.tmu.edu.tw).

Citation

Wu L, Weng P, Chen C, et al
Literature Review and Meta-Analysis of Transcutaneous Electrical Nerve Stimulation in Treating Chronic Back Pain

Publication history

  • First published May 1, 2018.
Online issue publication 
February 27, 2019

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